Jade Pro

Ultra-flexible, offline, multi-platform selective soldering system

Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys without incurring expensive down time, whilst the solder bath cools down and heats up during a regular manual changeover process.



The Jade Pro is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457mm x 508mm.

As standard, the Jade Pro is configured with our Duplex twin solder bath arrangement. This twin independent Z axis solder bath arrangement offers increased production flexibility by permitting use of two different nozzle tip sizes within any single process programme, which can be allocated as process requirements dictate within any particular area on a PCB. Alternatively, different solder alloys can be utilised within this single machine setup.

The Jade Pro series is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with a PCB image display.

Additionally, our PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

For visual information about our Jade Pro, please visit our YouTube channel’s video here: Pillarhouse Jade Pro Series – YouTube

For more information about Pillarhouse International’s other handload selective soldering systems, please visit: Selective Soldering – Handload – Pillarhouse International

Standard Features

  • Integral PC & Machine Mounted TFT Monitor
  • Duplex Twin Independent Z Axis Solder Pots
  • Auto Solder Top-Up (Wire Feed) & Solder Level Detect
  • DC Servo Drives
  • Manual Fiducial Correction System
  • Solder Wave Height Measurement & Correction
  • Pump RPM Monitoring
  • Auto Nozzle Conditioning System
  • Process Viewing Camera(s)
  • Multilevel Password Protection System
  • Inerted Nitrogen System
  • Drop-Jet Fluxer
  • Flux Level Sensor
  • Light Stack Tower
  • Six AP Style Solder Nozzle Tips
  • Internal Fume Extraction
  • Colour Programming Camera
  • Universally Adjustable Tooling Carrier
  • PillarCOMM Windows® based ‘Point & Click’ interface
  • PillarPAD Offline Programming System
  • Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
  • Solder Pot Coding
  • Lead-Free Compatibility
  • Day-To-Day Service Kit
  • Initial Solder Fill (63:37 only

Monitoring Options

  • Flux Presence Sensor – Thermistor Style
  • Flux Spray and/or Flow
  • Pump RPM
  • O2 PPM
  • Nitrogen Flow

System Options

  • Top Side & Bottom Side Slide In/Out Instant IR Pre-Heat
  • Closed-Loop Pyrometer Temperature Control
  • Bottom Side Hot Nitrogen Selective Pre-Heat
  • Automatic Fiducial Correction System
  • Ultrasonic Fluxing
  • Dual Drop-Jet/Ultrasonic Fluxing
  • Laser PCB Warp Correction
  • Micro Nozzle Assembly
  • Large Solder Bath for Dedicated Single Dip Applications
  • Solder Bath Removal Trolley
  • Solder Reel Identification
  • Larger PCB Handling Size


  • Height: 1230mm / 48” to 2025mm / 80″- with light stack
  • Width: 1250mm / 49“ to 1700mm / 67”- with side auto changer
  • Depth: 1495mm / 59”
    1720mm / 68” with flux bottles
  • Board size: 457mm x 508mm / 18”x 20”
  • Edge clearance: Above / below 3mm
  • Height clearance: Above / below 40mm nominal 90mm max. top-side only
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 20kg standard – 30kg large bath
  • Applicators: AP style – 2.5mm to 16mm dia.
    Extended AP style – 2.5mm to 20mm dia.
    Micro Nozzle – 1.5mm to 2.5mm
    Jet-Tip style – 6mm to 40mm dia.
    Jet-Wave style – up to 25mm width
    Special dedicated nozzles available upon request
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • X, Y & Z Axis resolution: 0.1mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
    Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Power supplies: Three-phase + neutral + PE
  • Voltage: 230V phase to neutral / 400V phase to phase
  • Frequency: 50/60Hz
  • Power : Maximum 9kVA per phase machine configuration dependent
  • Transport: Hand load
  • Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
  • Programming: PillarCOMM Windows® based ‘Point & Click’ interface


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