Jade Pro

Description

The Jade Pro is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457mm x 508mm.

As standard, the Jade Pro is configured with our Duplex twin solder bath arrangement. This twin independent Z axis solder bath arrangement offers increased production flexibility by permitting use of two different nozzle tip sizes within any single process programme, which can be allocated as process requirements dictate within any particular area on a PCB. Alternatively, different solder alloys can be utilised within this single machine setup.

The Jade Pro series is controlled by a PC, through PillarCOMM, a Windows^® based ‘Point & Click’ interface with a PCB image display.

Additionally, our PillarPAD offline programming package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

DC servo drives
Integral PC and machine mounted monitor
Twin solder bath capability on independent Z axis
Inerted Nitrogen system
Internal fume extraction
Titanium Drop-Jet fluxer
Universally adjustable tooling carrier
Auto motorised wire solder feed & level detect
Solder bath coding – identifies correct bath for program
Solder wave height measurement and correction
Set of AP style solder nozzle tips
Thermal nozzle calibration system using integrated setting camera
Auto-nozzle conditioning system
Manual fiducial correction system
Colour programming camera
Process viewing camera(s)
Multilevel password protection
Light stack
PillarCOMM Windows^® based ‘Point & Click’ interface
PillarPAD offline programming system
Lead-free compatible
Day-to-day service kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray, flow and spray & flow
Pump rpm
O₂ ppm
Nitrogen flow

System Options

Top-side instant IR preheat
Bottom-side slide in / out instant IR preheat
Closed loop pyrometer temperature control
Bottom side hot Nitrogen selective preheat
Automatic fiducial correction
Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Laser PCB warp correction
Micro nozzle assembly
Large solder bath for dedicated single dip applications
Solder bath removal trolley
Solder reel identification
Larger PCB handling size

Specifications

Height: 1230mm / 48” to 2025mm / 80″- with light stack
Width: 1250mm / 49“ to 1700mm / 67”- with side auto changer
Depth: 1495mm / 59”
1720mm / 68” with flux bottles
Board size: 457mm x 508mm / 18”x 20”
Edge clearance: Above / below 3mm
Height clearance: Above / below 40mm nominal 90mm max. top-side only
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 20kg standard – 30kg large bath
Applicators: AP style – 2.5mm to 16mm dia.
Extended AP style – 2.5mm to 20mm dia.
Micro nozzle – 1.5mm to 2.5mm
Jet-Tip style – 6mm to 40mm dia.
Jet-Wave style – up to 25mm width
Special dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
X, Y & Z Axis resolution: 0.1mm
Repeatability: +/- 0.05mm
Nitrogen usage: Up to 40 litres gas/min per bath with standard AP solder nozzle, 5 bar pressure.
Refer to Pillarhouse for Nitrogen usage requirement with dedicated multi-tube nozzle assemblies.
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar / 72 psi
Power supplies: Three-phase + neutral + PE
Voltage: 230V phase to neutral / 400V phase to phase
Frequency: 50/60Hz
Power : Maximum 9kVA per phase machine configuration dependent
Transport: Hand load
Tooling: Integral adjustable board guides, includes finger extensions and board clamps.
Programming: PillarCOMM Windows^® based ‘Point & Click’ interface

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