Soldering Technologies

Soldering is the process by which two or more items are joined together via melting and inserting a metal, i.e., solder, into the joint. This procedure is usually conducted after the surface mount reflow operation. Originally, soldering those hard to access areas of circuit boards and assemblies was carried out by hand operators using soldering irons. It has now become a recognised design process within the PCB manufacturing industry.

The Benefits Of Selective Soldering

Selective Soldering offers a significantly lower cost approach, over conventional wave soldering, when soldering through-hole components on mixed technology PCBs. It offers the ability to eliminate the need for costly wave solder pallets when using the traditional masking method. Furthermore, the quick interchange of solder baths e.g. eutectic to lead-free and vice versa, helps reduce production costs. Removing the need for hand soldering can greatly assist product quality and result in an enhanced production throughput.


  • Each solder joint has independent control – when using single tube nozzle
  • Minimal thermal shock
  • Low running cost
  • Operating under inert atmosphere
  • No need for expensive pallets
  • Suitable for low to high volume production
  • Fewer operators required
  • Repeatability
  • Non-contact application

Soldering In An Inert Atmosphere

Soldering in an environment with minimal oxygen level results in reduced oxidation and gives a number of benefits:

  • The amount of dross is greatly reduced.
  • The clean solder surface gives improved wetting performance.
  • Fewer solder defects.

Pillarhouse uses an inert Nitrogen atmosphere in which to operate. This enhances the process performance of fluxes that would otherwise be ineffective because of their reduced content of fluxing agents.

Soldering Techniques

Pillarhouse International uses several soldering technologies to suit customers’ specific needs. Whether that is the high precision and flexibility of the patented 1.5mm micronozzle; our all-purpose AP-1 nozzles; or the high-speed options of the Jet Wave/multi-dip soldering method.

AP Nozzle

High flexibility, low to medium volume production.


High flexibility, low to medium volume production. Especially good for longer component leads.

Jet Wave

Ideal for fast soldering of connectors and components with longer pins.


Suited for applications with ultra-close proximity SMT components on the same side of the PCB. Available in 1.5mm and 2.5mm sizes.

Wide Wave

Provides a wave soldering capability to solder large areas. Available in 75mm and 150mm widths.

Custom Nozzles

Product specific nozzle designed for high volume single dip production.