Elementary, flexible, single point selective soldering system

Designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, the Jade MKll entry-level system offers uncompromised selective soldering quality at a very low cost.

The Jade MKII is a handload system, incorporating a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to 457 x 508mm (18″ x 20″).

Our patented Drop-Jet design fluxer offers quick and effective flushing of the pressurised flux chamber. This helps to keep maintenance levels to a minimum whilst enabling use of higher solid content fluxes as well as water-soluble fluxes.


As part of the entry-level philosophy for the Jade MKII, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return-to-bath technology offering reduced solder balling potential.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Jade MKII is controlled by a PC through our next generation PillarCOMMX software, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

For visual information about our Jade MKII, please visit our YouTube channel’s video here: Pillarhouse Jade Mk II – YouTube

For more information about Pillarhouse International’s other handload selective soldering systems, please visit: Selective Soldering – Handload – Pillarhouse International

Standard Features

  • Integral PC & Machine Mounted TFT Monitor
  • Inerted Nitrogen System
  • Auto Solder Top-Up (Wire Feed) & Solder Level Detect
  • Drop-Jet Fluxer
  • Internal Fume Extraction
  • Colour Programming Camera
  • Universally Adjustable Tooling Carriers
  • Manual Fiducial Correction System
  • PillarCOMMX Windows® based ‘Point & Click’ interface
  • PillarPAD Offline Programming System
  • Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
  • Solder Wave Height Measurement
  • Process Viewing Camera
  • Multilevel Password Protection System
  • Lead-Free Compatibility
  • Set of AP Style Solder Nozzle Tips
  • Day-To-Day Service Kit

Monitoring Options

  • Flux Presence Sensor – Thermistor Style
  • Flux Spray and/or Flow
  • Pump RPM
  • O2 PPM
  • Nitrogen Flow

System Options

  • Top Side Instant IR Pre-Heat
  • Closed Loop Temperature Control – via Pyrometer or Thermocouple
  • Bottom Side IR Ring Heater
  • Bottom Side Hot Nitrogen Selective Pre-Heat
  • Automatic Fiducial Correction System
  • Ultrasonic Fluxing
  • Dual Drop-Jet/Ultrasonic Fluxing
  • Laser PCB Warp Correction
  • Micro Nozzle Assembly
  • Solder Reel Identification
  • Rapid Change Solder Bath and Pump System Capability – does not include solder bath and pump
  • Solder Bath Coding (identifies correct bath for program, only suitable for use with Rapid Change Solder Bath and Pump System)
  • Encoders on X, Y and Z axis
  • Larger PCB Handling Size
  • Nitrogen Generator


  • Height: 1403mm / 55” – excluding light stack
  • Width: 1000mm / 40“
  • Depth: 1351mm / 53”
  • Board size: 457mm x 508mm / 18”x 20” (larger PCB size available upon request)
  • Edge clearance: Above / below 3mm
  • Height clearance: Above / below 40mm nominal
    Above 190mm – special application
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 8kg
  • Applicators: AP style – 2.5mm to 16mm dia.
    Extended AP style – 2.5mm to 20mm dia.
    Micro nozzle – 1.5mm to 2.5mm
    Jet-Tip style – 6mm to 20mm dia.
    Jet-Wave nozzle – up to 25mm width
    Special dedicated nozzles available upon request
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water soluble system available
  • X, Y & Z Axis resolution: 0.1mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: 35 litres gas/min. 5 bar pressure
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Power supplies: Single phase + PE
  • Voltage: 208V – 250V
  • Frequency: 50/60Hz
  • Power : 4kVA
  • Power with IR preheat: 6.5kVA – Top-side
    8kVA – Top with bottom-side ring heater
  • Transport: Hand load
  • Tooling: Integral adjustable board guides, includes finger extensions and board clamps
  • Programming: PillarCOMM Windows® based ‘Point & Click’ interface


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