Orissa Synchrodex Pro

Enhanced, flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex Pro range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together.


The standard Synchrodex Pro solder module is supplied with an on-board Drop-Jet flux head and offers top side and bottom side slide in/out infra-red pre-heat linked to closed-loop pyrometer control. Pillarhouse can also configure any of our frame sizes to operate as dedicated fluxing and/or I.R./convection heating modules, which, when placed in-line with solder module(s), will significantly increase production throughput.

Our 1600mm solder module offers the ability to process PCBs using either a single or dual-bath operating format. Single bath operation allows for an alternate nozzle process on a single 610mm x 610mm PCB. Dual-bath operation allows for a dual-board, simultaneous, independent nozzle process for increased soldering flexibility on 420mm x 610mm PCBs. Pillarhouse’s uniquely flexible approach is facilitated via a software controlled, mechanical three pin stop arrangement on the conveyor section allowing for either single or dual PCB management.

Our largest PCB handling capability of 1143mm x 610mm can be achieved when using the XL frame size.

The Synchrodex Pro can be configured with any of the currently available Pillarhouse solder technologies, including single point AP-1, patented 1.5mm micronozzle, Jet-Wave and custom multi-dip. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

The Synchrodex Pro is controlled by a PC through our next generation PillarCOMM.NET, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, PillarCOMM.NET has an offline package that allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

  • Up to  1140mm x 610mm (45” x 24”) board handling with 610mm x 610mm (24″ x 24″) as standard
  • Interchangeable Mechanical or Magnetic solder bath and pump
  • Lead-free solder capability
  • Inerted Nitrogen system
  • Set of AP style solder nozzle tips
  • Automatic nozzle conditioning system
  • Thermal nozzle calibration
  • Solder level detect and motorised wire feeder
  • Wave height correction
  • DC drives on all axes
  • Colour programming camera
  • Automatic fiducial correction
  • Drop Jet fluxer
  • Internal fume extraction
  • Integral PC and monitor
  • New PillarCOMM control software
  • Multiple level password protection
  • IPC-2591 (CFX), Smart Factory ready

Monitoring Options

  • Flux spray, flow and spray & flow
  • Pump rpm
  • O2 ppm
  • Nitrogen flow

System Options

  • High definition process viewing camera
  • Top side IR preheat, with closed-loop control
  • Motorised underside IR preheat, at all cell positions
  • Ultrasonic fluxing
  • Dual Drop-Jet / Ultrasonic fluxing
  • Laser-based PCB warp correction
  • Micro nozzle assembly
  • Solder reel identification
  • Nitrogen generator


  • Height: 1391mm / 55” – excluding light stack
  • Width: 958mm / 38“
  • Depth: 2010mm / 79”
  • Board size: Max. – 1140mm x 610mm (45” x 24”) or 610mm x 610mm (24″ x 24″)
    Min. – 102mm x 102mm / 4”x 4”
  • Edge clearance: Above/below 3mm
  • Height clearance: Below 40mm – above 45mm
    100mm – upon request
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 20kg standard
  • Applicators: AP style – 2.5 – 16mm dia.
    Extended and Jet-Tip nozzles – up to 25mm dia.
    Jet-Wave nozzles – up to 25mm width
    75mm and 150mm Wave nozzle
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • Flux tank capacity: 1 litre
  • Fluxer speed: 50 dots/second
  • Deposition size: 4.0-6.0mm / 0.16-0.24”
  • X, Y & Z axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen supply pressure: 5 bar / 72 psi
  • Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Air usage: 10 litres/min. / 0.35 CFM
  • Power supplies: Three-phase + neutral + PE
  • Voltage: 230 V phase to neutral / 400V phase to phase
  • Frequency: 50/60Hz
  • Power: Machine configuration dependent – contact your local Pillarhouse representative
  • Transport: Conveyor

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