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Fusion - In-Line
Orissa Fusion
Orissa Fusion
Orissa Fusion
Orissa Fusion
Orissa Fusion
Orissa Fusion

Orissa Fusion

High speed, in-line, multi-platform selective soldering system

Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.

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Description

The Orissa Fusion is available in two frame sizes.

Fusion Compact

The three-station cell Fusion 3 Compact – fluxer, pre-heat, solder – can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For increased soldering capability, this same unit can be configured as fluxer/pre-heat and two solder modules.

Fusion Standard

The standard four-station cell Fusion 4 – fluxer, pre-heat, solder, solder – can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For high-speed applications, this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options.

Each Orissa Fusion solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micronozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

 

For visual information about our Orissa Fusion, please visit our YouTube channel’s video here: Pillarhouse Orissa Fusion – YouTube

For more information about Pillarhouse International’s other in-line selective soldering systems, please visit: Selective Soldering – In-Line – Pillarhouse International

Configurations

Fusion Compact

Fusion 3 Compact – with independent Drop-Jet fluxer, top & bottom IR pre-heat and single solder module (includes top side IR pre-heat above solder module)
Fusion 3 Compact – with independent Drop-Jet fluxer and twin single solder modules (includes top side IR pre-heat above both solder modules)

Fusion Standard

Fusion 4 Standard – with independent Drop-Jet fluxer, top & bottom IR pre-heat and twin solder modules (includes top side pre-heat above both solder modules)
Fusion 4 Standard – with independent Drop-Jet fluxer and triple single solder modules (includes top side pre-heat above all three solder modules)

Standard Features

  • Integral PC & Machine Mounted TFT Monitor
  • In-Line Motor Driven Auto Width Adjust Throughfeed Conveyor
  • Auto Motorised Wire Solder Feeder & Level Detect
  • DC Servo Motor Axis Drive System
  • Auto Fiducial Recognition & Correction System
  • Solder Wave Height Measurement System
  • Auto Nozzle Conditioning System
  • Process Viewing Camera
  • Multilevel Password Security System
  • Inerted Nitrogen System
  • Pump RPM Monitoring – enabled as standard but option to disable if preferred
  • Drop-Jet Fluxer
  • Flux Level Sensor
  • Light Stack Tower
  • Six AP Solder Nozzle Tips
  • Internal Fume Extraction
  • Colour Programming Camera
  • Thermal Nozzle Calibration System using Integrated Setting Camera (requires
    manual correction)
  • Solder Pot Coding
  • PillarCOMM.NET Windows® based ‘Point & Click’ interface
  • Offline Programming Software
  • Lead-Free Compatible
  • Day-To-Day Service Kit

Monitoring Options

  • Flux Presence Sensor – Thermistor Style
  • Flux Spray and/or Flow
  • Pump RPM
  • 02 PPM
  • Nitrogen Flow

System Options

  • Ultrasonic Fluxing
  • Dual Drop-Jet/Ultrasonic Fluxing
  • Top Side Instant IR Pre-Heat
  • Bottom Side IR Pre-Heat
  • Closed-Loop Pyrometer Temperature Control
  • Large Solder Bath for Dedicated Single Dip Applications
  • Laser PCB Warp Correction
  • 1.5mm Micro Nozzle
  • Solder Reel Identification
  • Larger PCB Handling Size
  • Nitrogen Generator

Specifications

  • Height: 1390mm/55” to 2045mm/80½”- with light stack
  • Width: 2193mm/86½“ Compact
    2930mm/115½” Standard
  • Depth: 1520mm/60”
    1740mmm/68½” with flux bottles
  • Board size: 381mm x 430mm/15”x 17” – larger size available upon request
  • Edge clearance: Above/below 3mm
  • Height clearance: Above/below 40mm nominal, 70mm max.
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 6-7kg standard – 30kg large bath
  • Applicators: AP style – 2.5 – 16mm dia.
    Extended and Jet-Tip nozzles – up to 25mm dia.
    Jet-Wave nozzles – up to 25mm width
    Special dedicated nozzles available upon request
    Flux: Low maintenance Drop-Jet system. Low solids
    (below 8%), no clean flux, pressurised and inerted
    system, optional water-soluble system available
  • X, Y & Z axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: 40 litres gas/min per bath using single bath with
    standard AP solder nozzle, 5 bar/72 psi pressure.
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar/72 psi
  • Power supplies: Three-phase + neutral + PE
  • Voltage: 230V phase to neutral/400V phase to phase
  • Frequency: 50/60Hz
  • Power: Machine configuration dependent
    – contact your local Pillarhouse representative
  • Transport: Motorised conveyor
  • Programming: PillarCOMM.NET Windows® based ‘Point & Click’ interface

Videos

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