Orissa Synchrodex

Flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together.


Supplied as standard with our patented design Drop-Jet fluxer, the Orissa Synchrodex offers accurate, controlled flux deposition either prior to or during the optional top side pre-heat function. Pre-heat can be controlled via an optional top side closed-loop pyrometer system for optimum temperature profile regulation.

Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology – single point AP nozzle design – incorporating patented spiral solder return to bath technology, offering increased wave stability with reduced potential for solder balls.

This system can also accommodate our latest generation Micro Nozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and assists in the prevention of oxidation. This process provides a local pre-heat to the joint, thus reducing thermal shock to localised components.

The Orissa Synchrodex is controlled by a PC, through PillarCOMMX, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

For visual information about our Synchrodex, please visit our YouTube channel’s video here: Pillarhouse Orissa Synchrodex – YouTube

For more information about Pillarhouse International’s other in-line selective soldering systems, please visit: Selective Soldering – In-Line – Pillarhouse International

Standard Features

  • In-Line Motor Driven Auto Width Adjust Throughfeed Synchronous Movement Conveyor
  • Conveyor Side Clamping
  • Integral PC & Machine Mounted TFT Monitor
  • Auto Motorised Solder Wire Feed & Level Detect
  • Heated Inerted Nitrogen System
  • Drop-Jet Fluxer
  • Set of AP Solder Nozzle Tips
  • Internal Fume Extraction
  • Solder Wave Height Measurement & Correction System
  • Colour Programming Camera
  • Light Stack Tower
  • Windows® based PillarCOMMX ‘Point & Click’ interface
  • PillarPAD Offline Programming System
  • Auto Fiducial Recognition & Correction System
  • Flux Level Sensor
  • Multilevel Password Protection
  • SMEMA Compatible
  • Process Viewing Camera with Record Feature
  • Lead-Free Solder Capability
  • Day-To-Day Service Kit

Monitoring Options

  • Flux Presence Sensor – Thermistor Style
  • Flux Spray and/or Flow
  • Pump RPM
  • O2 PPM
  • Nitrogen Flow

System Options

  • Ultrasonic Fluxing
  • Dual Drop-Jet/Ultrasonic Fluxing
  • Top Side Instant IR Pre-Heat
  • Closed-Loop Pyrometer Temperature Control
  • Bottom Side Hot Nitrogen Selective Pre-Heat
  • Laser PCB Warp Correction
  • Solder Reel Identification
  • Solder Bath Coding (identifies correct bath for program)
  • Encoders on X, Y and Z Axis
  • Nitrogen Generator


  • Height: 1615mm / 63” – excluding light stack
  • Width: 813mm / 32“
  • Depth: 2024mm / 80”
  • Board size: Max. – 457mm x 610mm / 18”x 24”
    Min. – 102mm x 102mm / 4”x 4”
  • Edge clearance: Above/below 3mm
  • Height clearance: Below 40mm – above 45mm
    100mm – upon request
  • Extraction: Fan: 276mm dia.
  • Rating: 1000m3/hr / 589 CFM
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 15kg standard – 25kg large bath
  • Applicators: AP style – 2.5 – 16mm dia.
    Extended and Jet-Tip nozzles – up to 25mm dia.
    Jet-Wave nozzles – up to 25mm width
    150mm Wave nozzle
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • Flux tank capacity: 1 litre
  • Fluxer speed: 50 dots/second
  • Deposition size: 4.0-6.0mm / 0.16-0.24”
  • X, Y & Z axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen supply pressure: 5 bar / 72 psi
  • Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Air usage: 10 litres/min. / 0.35 CFM
  • Power Supplies: Single phase + PE
  • Voltage: 230V
  • Frequency: 50/60Hz
  • Power: 10.5kVA max. – machine configuration dependent
  • Transport: Conveyor


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