Products

Orissa Fusion
Orissa Fusion
Orissa Fusion
Orissa Fusion
Orissa Fusion
Orissa Fusion
Orissa Fusion

Orissa Fusion

High speed, in-line, multi-platform selective soldering system

Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
The standard four station cell can be configured to handle PCB’s up to 381mm x 460mm – fluxer, preheat, solder, solder. For high speed applications this same unit can be configured as fluxer/preheat and up to three solder modules with as many as five heater options.

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Description

The Orissa Fusion is available in two frame sizes.

Fusion Compact

The standard three station cell can be configured to handle PCB’s up to 381mm x 430mm (fluxer, pre-heat and solder).   Alternatively, this system can be supplied as a two station unit each with increased PCB handling capacity up to 746mm x 430mm.

Fusion Standard

The standard four station cell can be configured to handle PCB’s up to 430mm x 381mm (fluxer, pre-heat, solder, solder).  For high speed applications this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options. Maximum PCB handling size in Y Axis of up to 500mm with limited auto-fiducial and PCB warp correction function up to 430mm.

Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle.

Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

Configurations

Compact Fusion

Fusion 2 Compact – with Drop-Jet Fluxer, Solder Module (Large PCB Format) includes bottom side slide in / out Pre-heat at Flux station (includes topside IR preheat above solder module)
Fusion 3 Compact – with independent drop jet fluxer, top & bottom I.R. preheat and single solder module (includes topside IR preheat above solder module)
Fusion 3 Compact – with independent drop jet fluxer and twin single solder modules (includes topside IR preheat above both solder modules)

Standard Fusion

Fusion 2 – with independent flux and solder module (includes topside IR preheat above solder module)
Fusion 3 – with independent drop jet fluxer, top & bottom I.R. preheat and single solder module (includes topside IR preheat above solder module)
Fusion 3 – with independent drop jet fluxer and twin single solder modules (includes topside preheat above both solder modules)
Fusion 4 – with independent drop jet fluxer, top & bottom I.R. pre-heat and twin solder modules (includes topside preheat above both solder modules)
Fusion 4 – with independent drop jet fluxer and triple single solder modules (includes topside preheat above all three solder modules)

Standard Features

  • Integral PC and machine mounted Titanium monitor
  • In-line motor driven width adjust through feed conveyor
  • Conveyor side clamping
  • DC servo drives with encoders on X, Y & Z axis
  • Inerted Nitrogen system
  • Internal fume extraction
  • Titanium Drop-Jet fluxer
  • Motorised wire feed auto solder top-up & solder level detect
  • Solder wave height measurement and correction system
  • Solder bath coding – identifies correct bath for program
  • Thermal nozzle calibration system using integrated setting camera
  • Auto-nozzle conditioning system
  • Pump rpm
  • Set of AP solder nozzle tips
  • Colour programming camera
  • Process viewing camera
  • Automatic fiducial correction system
  • Multiple level password protection
  • Light stack
  • Flux level sensor
  • PillarCOMM Windows® based ‘Point & Click’ interface
  • Lead-free compatible
  • Day-to-day service kit

Monitoring Options

  • Flux presence sensor – thermistor style
  • Flux spray, flow and spray & flow
  • O2 ppm
  • Nitrogen flow

System Options

  • Ultrasonic fluxing
  • Dual Drop-Jet / ultrasonic fluxing
  • Top-side instant IR preheat
  • Bottom-side IR preheat
  • Closed loop pyrometer temperature control
  • Large solder bath for dedicated single dip applications
  • Laser PCB warp correction
  • 1.5mm micro nozzle
  • Solder reel identification
  • Larger PCB handling size
  • Nitrogen generator

Specifications

  • Height: 1390mm / 55” to 2045mm / 80½”- with light stack
  • Width: 2193mm / 86½“ Compact
    2930mm / 115½” Standard
  • Depth: 1520mm / 60”
    1740mmm / 68½” with flux bottles
  • Board size: 381mm x 460mm / 15”x 18” (Standard frame with 4 stations)
    Larger PCB size available upon request
  • Edge clearance: Above / below 3mm
  • Height clearance: Above / below 40mm nominal, 70mm max.
  • Solder: Most commonly used solder types – including lead-free
  • Solder pot capacity: 20kg standard – 30kg large bath
  • Applicators: AP style – 2.5 – 16mm dia.
    Extended and Jet-Tip nozzles – up to 25mm dia.
    Jet-Wave nozzles – up to 25mm width
    Special dedicated nozzles available upon request
  • Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
  • X, Y & Z Axis resolution: 0.15mm
  • Repeatability: +/- 0.05mm
  • Nitrogen usage: 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
  • Nitrogen purity: 99.995% or better
  • Air supply pressure: 5 bar / 72 psi
  • Power supplies: Three-phase + neutral + PE
  • Voltage: 230 V phase to neutral / 400V phase to phase
  • Frequency: 50/60Hz
  • Power : Machine configuration dependent – contact your local Pillarhouse representative
  • Transport: Motorised conveyor
  • Programming: PillarCOMM Windows® based ‘Point & Click’ interface

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