Enhanced, flexible, in-line, modular selective soldering system
Our Synchrodex Pro is a modular system with a range of in-line equipment offering the ultimate in flexibility, with the ability to upgrade to high-speed throughput when multiple modules are placed together.
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The standard Synchrodex Pro solder module is supplied with an on-board Drop-Jet flux head and offers optional top side and bottom side slide in/out infra-red pre-heat linked to closed-loop pyrometer control. Pillarhouse can also configure any of our frame sizes to operate as dedicated fluxing and/or I.R./convection heating modules, which, when placed in-line with solder module(s), will significantly increase production throughput.
Our 1600mm solder module offers the ability to process PCBs using either a single or dual-bath operating format. Single bath operation allows for an alternate nozzle process on a single 610mm x 610mm PCB. Dual-bath operation allows for a dual-board, simultaneous, independent nozzle process for increased soldering flexibility on 420mm x 610mm PCBs. Pillarhouse’s uniquely flexible approach is facilitated via a software controlled, mechanical three pin stop arrangement on the conveyor section allowing for either single or dual PCB management.
Our largest PCB handling capability of 1200mm x 610mm can be achieved when using the XL frame size.
The Orissa Synchrodex Pro can be configured with any of the currently available Pillarhouse solder technologies, including single point AP-1, patented 1.5mm Micro Nozzle, Jet Wave and custom multi-dip. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.
The Synchrodex Pro is controlled by a PC through our next generation PillarCOMM.NET software – a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, PillarCOMM.NET has an offline package that allows the operator to produce programs independently from the machine using Gerber data.
For more information about Pillarhouse International’s other modular in-line selective soldering systems, please visit: Modular In-Line Archives – Pillarhouse International
Standard Features
- In-Line Disk Drive Auto Width Adjust Through-Feed Synchronous
- Movement Conveyor
- Conveyor Side Clamping
- Integral PC and Machine Mounted TFT Monitor
- Auto Motorised Solder Wire Feed & Level Detect
- Drop-Jet fluxer
- Heated Inerted Nitrogen System
- Internal Fume Extraction
- Colour Programming Camera
- 610mm x 610mm (24″ x 24″) Board Handling Size in a 1060mm Frame
- PillarCOMM.NET Windows® based Software
- Offline Programming Software
- Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
- Solder Pot Coding
- Auto Fiducial Recognition & Correction System
- Solder Wave Height Measurement
- Mechanical Impellor Style Pump Assembly
- Pump RPM Monitoring
- Nitrogen Analyser
- Auto Nozzle Conditioning System
- Process Viewing Camera
- Multilevel Password Security System
- Light Stack Tower
- Flux Level Sensor
- Lead-Free Capability
- One Set of AP Solder Nozzle Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm, 12mm) per Solder Bath
- Accessory Kit
Monitoring Options
- Flux Flow Monitoring
- Nitrogen Purity Monitoring
- Nitrogen Mass Flow Meter
- Nozzle Nitrogen Purity Monitoring
System Options
- High-Definition Process Viewing Camera
- Top Side IR Pre-Heat, with Closed-Loop Control
- Motorised Underside IR Pre-Heat
- Ultrasonic Fluxing
- Additional Dual Drop-Jet/Ultrasonic Fluxing
- Laser PCB Warp Correction
- 1.5, 2, 2.5mm Micro Nozzle(s)
- Solder Reel Identification
- Nitrogen Generator
- PillarCARE – our comprehensive after-sale service and process programme
Specifications
- Height: 1391mm/55” – excluding light stack and monitor
- Width: 1060mm/42“ or 1600mm/63” (depending on frame size)
- Depth: 2250mm/88”
- Board size: Min. – 102mm x 102mm/4” x 4”
- Max. (standard variants) – 420mm x 610mm/16.5” x 24” and 610mm x 610mm/24”x 24” (optional sizes) – 1200mm x 610mm/45” x 24”
- Edge clearance: Above/below 3mm
- Height clearance: Above 45mm/below 40mm nominal
- Extraction: Fan: 236mm dia.
- Rating: 940m³/hr/553CFM
- Solder: Most commonly used solder types – includes lead-free
- Solder pot capacity: 11kg/24lb (standard) – 20kg/44lb (large)
- Nozzles/Applicators: Micro Nozzle – 1.5mm to 2.5mm
AP style – 2.5mm to 16mm dia.
Extended AP style – 2.5mm to 16mm dia.
Jet-Tip style – 6mm to 25mm dia.
Jet-Wave nozzle – up to 40mm width
75mm and 150mm Wave nozzle
Special dedicated nozzles available upon request - Flux: Low maintenance Drop-Jet system. Low solids (below
8%), no clean flux, pressurised and inerted system,
optional ultrasonic system available - X, Y & Z axes resolution: 0.15mm
- Repeatability: +/- 0.05mm
- Nitrogen supply pressure: 5 bar/72 psi
- Nitrogen usage: 30-100 litres/min./1.06-3.53 CFM- solder nozzle configuration dependent
- Nitrogen purity: 99.995% or better
- Air supply pressure: 5 bar/72 psi
- Air usage: 10 litres/min./0.35 CFM
- Power supplies: Three-phase + neutral + PE
- Voltage: 230 V phase to neutral/400V phase to phase
- Frequency: 50/60Hz
- Power: Machine configuration dependent
- Transport: Conveyor (IPC-SMEMA-9851 compliant)
- Programming: PillarCOMM.NET software – Windows® based ‘Point & Click’ interface
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