High-speed, in-line, multi-platform selective soldering system
Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings.
Contact about this product
- Description
- Configurations
- Standard Features
- Monitoring Options
- System Options
- Specifications
- Video
- Brochure
The Orissa Fusion is available in two frame sizes:
Fusion Compact
The standard three station cell Fusion 3 Compact – fluxer, pre-heat, solder – can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size of 381mm x 460mm available when auto fiducial correction and PCB warp correction are excluded. For increased soldering capacity this same unit can be configured as fluxer/pre-heat and two solder modules.
Fusion Standard
The standard four station cell Fusion 4 Standard – fluxer, pre-heat, solder, solder – can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size of 381mm x 460mm available when auto fiducial correction and PCB warp correction are excluded. For high-speed applications this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options.
Each Orissa Fusion solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave, and single point AP down to the patented 1.5mm Micro Nozzle. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.
For more information about Pillarhouse International’s other in-line selective soldering systems, please visit: In-Line Archives – Pillarhouse International
Configurations
Fusion Compact
Fusion 3 Compact – with independent Drop-Jet fluxer, top & bottom IR pre-heat and single solder module (includes top side IR pre-heat above solder module)
Fusion 3 Compact – with independent Drop-Jet fluxer and twin single solder modules (includes top side IR pre-heat above both solder modules)
Fusion Standard
Fusion 4 Standard– with independent Drop-Jet fluxer, top & bottom IR pre-heat and twin solder modules (includes top side pre-heat above both solder modules)
Fusion 4 Standard – with independent Drop-Jet fluxer and triple single solder modules (includes top side pre-heat above all three solder modules)
Standard Features
- Integral PC and Machine Mounted TFT Monitor
- In-Line Motor Driven Auto Width Adjust Through-Feed Conveyor
- Auto Motorised Solder Wire Feed & Level Detect
- DC Servo Motor Axis Drive System
- Auto Fiducial Recognition & Correction System
- Solder Wave Height Measurement System
- Inerted Nitrogen System
- Pump RPM Monitoring – enabled as standard but option to disable if preferred
- Drop-Jet Fluxer
- Flux Level Sensor
- Light Stack Tower
- One Set of AP Solder Nozzle Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm, 12mm) per Solder Bath
- Internal Fume Extraction
- Colour Programming Camera
- Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
- Solder Pot Coding
- PillarCOMM.NET Windows® based ‘Point & Click’ interface
- Offline Programming Software
- Lead-Free Compatible
- Day-To-Day Service Kit
Monitoring Options
- Flux Presence Sensor – Thermistor Style
- Flux Spray and/or Flow
- Pump RPM
- O2 PPM
- Nitrogen Flow
System Options
- Ultrasonic Fluxing
- Dual Drop-Jet/Ultrasonic Fluxing
- Top Side Instant IR Pre-Heat
- Bottom Side IR Pre-Heat
- Closed-Loop Pyrometer Temperature Control
- Large Solder Bath for Dedicated Single Dip Applications
- Laser PCB Warp Correction
- 1.5mm Micro Nozzle
- Solder Reel Identification
- Larger PCB Handling Size
- Nitrogen Generator
- PillarCARE – our comprehensive after-sale service and process programme
Specifications
- Height: 1390mm/55” to 2045mm/80½”- with light stack
- Width: 2193mm/86½ “Compact
- 2930mm/115½” Standard
- Depth: 1520mm/60”
- – 1740mmm/68½” with flux bottles
- Board size: 381mm x 430mm/15”x 17” – larger size available upon request
- Edge clearance: Above/below 3mm
- Height clearance: Above/below 40mm nominal, 70mm max.
- Solder: Most commonly used solder types – including lead-free
- Solder pot capacity: 6-7kg standard – 30kg large bath
- Applicators: AP style – 2.5 – 16mm dia.
- – Extended and Jet-Tip nozzles – up to 25mm dia.
- – Jet-Wave nozzles – up to 25mm width
- – Special dedicated nozzles available upon request
- Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
- X, Y & Z axis resolution: 0.15mm
- Repeatability: +/- 0.05mm
- Nitrogen usage: 40 litres gas/min per bath using single bath with
- standard AP solder nozzle, 5 bar/72 psi pressure.
- Nitrogen purity: 99.995% or better
- Air supply pressure: 5 bar/72 psi
- Power supplies: Three-phase + neutral + PE
- Voltage: 230V phase to neutral/400V phase to phase
- Frequency: 50/60Hz
- Power: Machine configuration dependent
– contact your local Pillarhouse representative - Transport: Motorised conveyor
- Programming: PillarCOMM.NET Windows® based ‘Point & Click’ interface
Video
Brochure
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