Orissa Fusion

High speed, in-line, multi-platform selective soldering system

Incorporating high speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings. The standard four station cell can be configured to handle PCB’s up to 381mm x 460mm – fluxer, preheat, solder, solder. For high speed applications this same unit can be configured as fluxer/preheat and up to three solder modules with as many as five heater options.


An optional PCB transfer station and return conveyor enables product to be manually unloaded adjacent to the conveyor load station – this configuration reduces PCB handling capability to 381mm x 250mm. Each solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micro nozzle. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

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