Over recent years there has been a big push to try and remove wave soldering from the through -hole assembly process. This is not always possible. Common wave associated problems such as bridging between pins and skipped joints etc. inevitably require a high reliance for a re-work function with this mode of operation. (더 보기…)
Pillarhouse International, in partnership with the Selective Soldering Academy, has produced a Technical Paper outlining the the different types of fluxs and their advantages and disadvantages.
Pillarhouse International, in partnership with the Selective Soldering Academy, has produced a Technical Paper on Closed Loop Top Side Preheat-How It
Impacts the Selective Soldering Process
Pillarhouse International, in partnership with the Selective Soldering Academy, has produced a Technical Paper on Board Warp, Sag, Twist and Arch – What Is It, What Causes It and How Can It Be Overcome in The Selective Soldering Process?
