The process by which conventional leaded components are soldered onto a PCB. Originally devised for soldering those hard to get to areas of a circuit board /assemblies which historically were carried out by hand operators using soldering irons. It has now become a recognised design process within the PCB manufacturing industry. This procedure is usually conducted after the surface mount reflow operation.
The Benefits Of Selective Soldering
Selective Soldering offers a significantly lower cost approach, over conventional wave soldering, when soldering through-hole components on mixed technology PCBs. It offers the ability to eliminate the need for costly wave solder pallets when using the traditional masking method. Furthermore, the quick interchange of solder baths e.g. eutectic to lead-free and vice versa, helps reduce production costs. Removing the need for hand soldering, can greatly assist product quality and result in an enhanced production throughput.
- Each solder joint has independent control – when using single tube nozzle
- Minimal thermal shock
- Low running cost
- Soldering under inert atmosphere
- No need for expensive pallets
- Suitable for low to high volume production
- Fewer operators required
- Non-contact application
Soldering In An Inert Atmosphere
By soldering in an environment with minimal oxygen level results in reduced oxidation and gives a number of benefits:
- The amount of dross is greatly reduced.
- The clean solder surface gives improved wetting performance.
- Fewer solder defects.
Pillarhouse uses an inert Nitrogen atmosphere in which to solder. This enhances the process performance of fluxes that would otherwise be ineffective because of their reduced content of fluxing agents.
Pillarhouse uses a number of technologies to suit the specific customers’ needs. Whether that is the high precision and flexibility of the patented 1.5mm Micro-Nozzle; our all-purpose AP-1 nozzles; or the high speed options of the Jetwave/Multi-dip soldering method.
High flexibility, low to medium volume production.
High flexibility, low to medium volume production. Especially good for longer component leads.
Ideal for fast soldering of connectors and components with longer pins.
Suited for applications with ultra-close proximity SMT components on the same side of the PCB. Available in 1.5 and 2.5mm sizes.
Product specific nozzle designed for high volume single dip production.