Category: Latest News

22 Sep 2023
SMTA Minneapolis 2023

Pillarhouse International at SMTA Minneapolis 2023

Pillarhouse International at SMTA Minneapolis 2023

Pillarhouse International will once again be exhibiting at the SMTA Minneapolis Exhibition, via Pillarhouse USA, at Booth 800 of the Minneapolis Convention Center, Minneapolis, Minnesota, from the 9th to the 12th of October 2023.

For over 40 years, Pillarhouse International has been designing and manufacturing specialist soldering equipment for the electronics industries, offering an extensive range of selective soldering solutions from low cost, flexible, standalone, benchtop, entry-level systems, through to advanced, high speed, integrated, in-line production cells.

SMTA’s local expos allow exhibitors to align their company with the same values of providing high-level technical expertise that SMTA represents. Providing this platform to bring professionals within the electronics and manufacturing industries together gives attendees exposure to global technology at a local level. In addition, the local expos allow an opportunity to educate regional engineers who may not be able to attend SMTA International.

Pillarhouse USA Vice President, Adrian De’Ath, said ahead of the show, “SMTA events are a key part of Pillarhouse USA’s calendar as they afford us such good opportunities to meet new and existing customers. Minneapolis is a city that has been good to Pillarhouse USA, so we are excited to return for the show.”

Pillarhouse International will be at Booth 800 of the Minneapolis Convention Center, Minneapolis, Minnesota, from the 9th to the 12th of October 2023.

For more information about SMTA Minneapolis 2023, please visit: SMTA

To view this event in Pillarhouse International’s calendar, please visit: Events – Pillarhouse International

20 Sep 2023
AEMS 2023

Pillarhouse International at AEMS 2023

Pillarhouse International at AEMS 2023

Pillarhouse International will once again be exhibiting at the Anaheim Electronics & Manufacturing Show, via Pillarhouse USA and our official agent Wittco Sales, at Booths 724-726 of the Anaheim Convention Center, Anaheim, California, from the 27th to the 28th of September 2023.

For over 40 years, Pillarhouse International has been designing and manufacturing specialist soldering equipment for the electronics industries, offering an extensive range of selective soldering solutions from low cost, flexible, standalone, benchtop, entry-level systems, through to advanced, high speed, integrated, in-line production cells.

AEMS is a regional trade show that showcases the latest products and services in the electronics, medical and biotech industries. It is a low cost, high value event that attracts exhibitors and attendees from various sectors, such as IC products and services, electronic components, manufacturing equipment and contract manufacturing services.

Pillarhouse USA Western Regional Sales Manager, Deon Nungaray, said ahead of the show, “AEMS is a great regional show that allows Pillarhouse, and our local agent Wittco Sales, to interact with the many electronics and manufacturing customers, both existing and potential, in the Southern California area. We had a good time here last year and are looking forward to returning and widening our contacts here further.”

Pillarhouse International will once again be exhibiting at the Anaheim Electronics & Manufacturing Show, via Pillarhouse USA and our official agent Wittco Sales, at Booths 724-726 of the Anaheim Convention Center, Anaheim, California, from the 27th to the 28th of September 2023.

For more information about AEMS 2023, please visit: aems (anaheimshow.com)

To view this event in Pillarhouse International’s calendar, please visit: Events – Pillarhouse International

19 Sep 2023
electronics & applications 2023

Pillarhouse International at Electronics & Applications 2023

Pillarhouse International at Electronics & Applications 2023

Pillarhouse International will once again be exhibiting at the Electronics & Applications 2023 Exhibition, via our agent SMD-Tec, where they will be showcasing our Orissa Synchrodex Pro machine at Booth 7F071 of Jaarbeurs Utrecht, Utrecht, Holland, from the 26th to the 28th of September 2023.

For over 40 years, Pillarhouse International has been designing and manufacturing specialist soldering equipment for the electronics industries, offering an extensive range of selective soldering solutions from low cost, flexible, standalone, benchtop, entry-level systems, through to advanced, high speed, integrated, in-line production cells.

SMD-Tec was founded in 2009 by a dedicated team of professionals with 15 years of hands-on electronics production experience wanted to offer technical advice and support to ensure the efficient running of machinery. As the most experienced electronics production leader in the Benelux region, SMD-Tec has the knowhow in everything related to electronics manufacturing.

Electronics & Applications is the number one trade fair for industrial electronics in the Benelux region. At this show, you can meet the entire chain, from components to production and from design services to completion. E&A is the meeting point for engineers, designers, developers, and non-tech engineers who are looking for solutions.

Tom Van Tongelen, SMD-Tec owner, said, “Electronics & Applications is a great show for manufacturers and suppliers in our region. It’s been almost four years since  we were last able to exhibit here, so we are excited and going big with our booth. We will be displaying Pillarhouse’s Synchrodex Pro selective soldering machine and are looking forward to showcasing this fine platform to potential customers at Booth 7F071.”

Pillarhouse International will once again be exhibiting at the Electronics & Applications 2023 Exhibition, via our agent SMD-Tec, where they will be showcasing our Orissa Synchrodex Pro machine at Booth 7F071 of Jaarbeurs Utrecht, Utrecht, Holland, from the 26th to the 28th of September 2023.

For more information about Electronics & Applications 2023, please visit: Electronics & Applications – De beurs voor Industriële Elektronica in de BeNeLux (fhi.nl)

To view this event in Pillarhouse International’s calendar, please visit: Events – Pillarhouse International

05 Sep 2023
productronica india 2023

Pillarhouse International at Productronica India 2023

Pillarhouse International at Productronica India 2023

Pillarhouse International will once again be exhibiting at the Productronica India 2023 Exhibition, via our agent Accurex Solutions, where they will be showcasing our Jade MKII machine in Hall 4, Booth PC25 of the Bangalore International Exhibition Centre, Bangalore, India from the 13th to the 15th of September 2023.

For over 40 years, Pillarhouse International has been designing and manufacturing specialist soldering equipment for the electronics industries, offering an extensive range of selective soldering solutions from low cost, flexible, standalone, benchtop, entry-level systems, through to advanced, high speed, integrated, in-line production cells.

Accurex Solutions was founded in 1987, committed to providing exceptional after sales service and transparency of operation, aiming to be the most reliable partner in your progress. With six branches spanning India’s electronic industrial hubs, Accurex is always close to their customers, ready to provide capital equipment for projects across PCB assemblies and semiconductors.

Productronica India is the most popular trade fair and exhibition for the Indian market of semiconductors and display manufacturing. The show features first-class forums and events which highlight the latest market trends and technologies, sharing knowledge to meet the needs of the growing Indian electronics industry.

Arvind Gopal Joshi, Accurex Solutions Director, said, “Productronica India is a very key and worthwhile show for Accurex. It gives us a platform where suppliers and customers meet from different fields. OEMs, contract manufacturers, EMS contractors – they all come and focus on their needs. We show the latest innovations and newest technologies in the belief that we can provide solutions. Productronica India is a great stage for networking opportunities with new customers.”

Pillarhouse will be represented by Accurex, where they will be showcasing our Jade MKII machine in Hall 4, Booth PC25 of the Bangalore International Exhibition Centre, Bangalore, India from the 13th to the 15th of September 2023.

For more information about Productronica India 2023, please visit: productronica India | Trade fair for electronics development and production (productronica-india.com)

To view this event in Pillarhouse International’s calendar, please visit: Events – Pillarhouse International

18 Jul 2023
nepcon china 2023

Pillarhouse International at Nepcon China 2023

Pillarhouse International at Nepcon China 2023

Pillarhouse International will return to Nepcon China, via Pillarhouse China, for the 2023 exhibition, at Stand IF10 of the Shanghai World Expo Exhibition & Convention Centre, from the 19th to the 21st of July 2023.

For over 40 years, Pillarhouse International has been designing and manufacturing specialist soldering equipment for the electronics industries, offering an extensive range of selective soldering solutions from low cost, flexible, standalone, benchtop, entry-level systems, through to advanced, high speed, integrated, in-line production cells.

Pillarhouse China was established in 2005 to provide customers in China and Taiwan world-leading selective soldering solutions, and to ensure Pillarhouse International’s dedication to developing a truly global identity.

After the challenges of the COVID-19 pandemic, Pillarhouse China are delighted to be fully back at the show, exhibiting three of our handload machines, and three of our in-line selective soldering systems, demonstrating Pillarhouse International’s variety of flexible and modular solutions.

Our handload models on display will include our entry-level, benchtop, single point Pilot machine; our elementary, flexible, single point Jade MKII; and our ultra-flexible, offline, multi-platform Jade pro. Our in-line models on display will include our high-speed, multi-platform Fusion machine; our enhanced, modular Synchrodex Pro system; and our brand new Synchrodex Solder Ball Remover module.

The Solder Ball Remover is a rotating brush system, deigned to remove the small number of solder balls and residue that may appear on PCBs after the soldering process.

We will also be presenting our cost-effective nitrogen generating systems – the PillarGEN 40 and PillarGEN 80 – which have been specifically designed to meet the nitrogen supply requirements of the current range of Pillarhouse International selective soldering systems.

Daren Harvey, Pillarhouse China General Manager, stated, “After three years of COVID-19, it is great to finally be back at Nepcon China. With borders well and truly open, we can expect a positive outlook on international travellers returning to China. We have seen significant growth in China, and indeed, worldwide, since our last attendance at this show.”

Harvey continued by saying, “We’re looking forward to showing you all the new range of equipment which has been developed over the last few years, including the AP Master Nozzle – our longer lasting solder nozzle – and our Solder Ball Remover.”

Eastern Region Sales Manager, Allan Jiang, South China & Taiwan Sales Manager, Penny Zhang, and South China Sales Manager, Derek Chen, will be present at Stand IF10, as well as Winnie, Jim and Hiro from After Sales & Service.

Pillarhouse will be at Stand IF10 of the Shanghai World Expo Exhibition & Convention Centre, from the 19th to the 21st of July 2023.

For more information about SMT Connect 2023, please visit: NEPCON China 2023: Shanghai Electronics, Semiconductor, and Automation Fair

To view this event in Pillarhouse International’s calendar, please visit: Events – Pillarhouse International

27 Jun 2023
AP Master Nozzle

AP Master Nozzle FAQ’s

AP Master Nozzle FAQ’s

Authored By: Dr. Samuel J. McMaster: [email protected]

Materials Scientist at Pillarhouse International Ltd.

 

The AP Master Nozzle represents a dramatic leap forward in nozzle performance, offering both improved lifetime and wetting. As these nozzles are now available, you may have questions about how they will fit in with your current soldering platform. This Q&A document will cover the most commonly asked questions about the AP Master Nozzle.

What features can be expected with the new AP Master Nozzle?

  • Better initial wetting for faster start-up of the nozzle and more user-friendly operation.
  • Innovative surface treatment improves long-term wetting and wear performance.
  • Lifetime predicted to be at least 8 times longer than a standard AP nozzle.
  • Surface treatment resists oxidation at high temperatures allowing for easier rewetting of the nozzle.
  • Better pull-off performance enables soldering of fine-pitch components.
  • Compatible with all current solders and fluxes on the market.
  • Compatible with the current Pillarhouse nozzle mounting system.
  • Available exclusively on all Pillarhouse machines using wettable nozzles.

What nozzles will be available in the new AP Master design?

All wetting nozzles will be available in the new design. This will encompass our AP, Jet Tip, Extended AP, Extended Jet Tip, and Micro Nozzles. The Wide Wave and Jet Wave apparatuses do not wet the solder and therefore remain unchanged. However, the wetted plates will utilise the new material design to improve their lifetime.

Is there any change in the mounting system?

No, so long as you are using the current external thread option (see Accessories & Spares brochure) you will be able to install the new nozzle into your soldering system. We will no longer be producing the mounting hardware for the internal thread system. If you are still using this system, please contact Pillarhouse and we will arrange a free-of-charge swap to the new mounting system.

Will the nozzles be available using the magnetic mounting system?

Yes, the nozzle can be made available for the magnetic mounting system, however, we always recommend threaded mounting as it is more secure.

Do I need to use different fluxes with the AP Master Nozzle?

No, the nozzle is compatible with all the current fluxes on the market. Pillarhouse continues to recommend the use of Activ8 to clean and tin the nozzles for manual cleaning. The adipic acid used in the auto tinning module will also be effective for maintaining the wetting of the solder to the nozzle.

The surface treatment applied to the nozzles increases the wettability and increases the resistance to oxidation, but maintenance must still be conducted and soldering in an inert atmosphere is essential.

Is there any difference in the wetting between the AP Master Nozzle and the original AP Nozzle?

The wettability of the AP Master Nozzle is greater than the original AP Nozzle. This allows for faster initial start-up of the nozzle, easier rewetting of the nozzle and soldering of finer pitch components. Wettability and spreading of the solder will always be poor in an oxygen-rich environment due to the oxide film that grows on both the solder and nozzle therefore nitrogen must still be used to inert the environment around the nozzle.

What lifetime can be expected with the AP Master Nozzle?

With the correct maintenance, the AP Master Nozzle will last at least 8 times that of the original AP Nozzle. On average, the original AP Nozzle (in 6 mm form) will last 213 hours. Therefore, the lifetime of the new nozzle will be approximately 1,700 hours. This estimate is based on ideal circumstances and can be affected by more corrosive solders, more extreme soldering processes, and poor maintenance.

How do I maintain the AP Master Nozzle?

Using the same methods as with the original AP Nozzles. Liquid flux should be used for manual cleaning. Abrasive cleaning can be used as with the original AP Nozzles, but this will remove more material from the nozzle and will decrease the overall lifetime; this should only be employed in extreme circumstances for dewetting issues. Overall, the same maintenance schedule should be followed as recommended by Pillarhouse.

How can I order the new AP Master Nozzle?

You can order the new AP Master Nozzle either directly from Pillarhouse or from our agents, as of right now. The new design will replace all our existing wetting nozzles from this time and all shapes will be available with the same part numbers as with the old design.

 

For more information on Pillarhouse International’s AP Master Nozzle, read here: Selective Soldering: A Need For Innovation and Development (pillarhouse.co.uk)

09 Jun 2023

Selective Soldering Challenges and Meeting Training Needs

Selective Soldering Challenges and Meeting Training Needs

Authored By: Dr. Samuel J. McMaster*1,2, Kane F. Witham*1, Professor Andrew Cobley*2, Dr. John E. Graves*2, Eddie Groves*3

1 – Pillarhouse International Ltd., Rodney Way, Chelmsford, CM1 3BY, UK

2 – Functional Materials and Chemistry Research Group, Research Centre for Manufacturing and Materials, Institute of Clean Growth and Future Mobility, Coventry University, Priory Street, Coventry CV1 5FB, UK

3 – Selective Soldering Academy, 201 Lively Blvd, Elk Grove Village, IL 60007

 

1.     Introduction

Selective soldering has grown in popularity over the past 25 years to now be a major connective technology in the electronics industry. The machines and techniques have progressed to being a major feature of in-line processes with the ability to flux, pre-heat[1] and solder through-hole technology (THT) components for printed circuit boards (PCBs) within a single machine or series of modular machines. As described by McMaster et al. [1], there are 2 classes of selective soldering machines: hand-load and in-line machines. As in-line systems are used for processing either a greater volume of boards or larger boards, many of the most challenging selective soldering processes are undertaken with this equipment.

[1] Typically fluxing will be applied before pre-heating for PCB solder processing so that the temperature of the pre-heat step can activate the flux.

2.     Challenges in selective soldering

Broadly, the challenges in selective soldering can be described as fitting into two main categories. The first of which is process requirements wherein a particular printed circuit board must be processed within a specific timeframe to meet the defined production schedule. The second of the challenges is the soldering of boards with increasing complexity of design, large amounts of surface mount components and high thermal mass. The following sections will discuss each of these challenges in more detail.

2.1. Process challenges

Multiple elements make up a selective soldering process [2]. The first of which is generally the fluxing step. Fluxing fulfils several purposes for the selective soldering process:

  • Creating a film between the solder mask and the solder to avoid the adherence of solder to the PCB.
  • Cleaning the metal surfaces of components to remove oxides to make soldering possible.
  • Promotes the wetting of the solder for better hole fill.
  • Aids in the prevention of solder bridges and solder balls.

There is no one size fits all flux; they can be alcohol-based, water-based or rosin based. Solid content can vary as can the active chemistry. Application methods can vary depending upon the process requirements but generally, two methods are used. The drop-jet can quickly apply miniature droplets in a precise fashion. Water and alcohol-based fluxes can be used with the drop-jet. When a larger area is to be soldered, an ultrasonic head is used. This fluxing module is lower maintenance and can handle higher solids content fluxes.

After fluxing, the board would generally be pre-heated. This activates the chemistry and prepares the board to better wet the applied solder. Most commonly, infrared (IR) lamps are used with a wavelength between 750 nm and 3000 nm. Balancing the wavelength of the IR with the absorption of heat of the parts is key. IR can quickly respond (1-3 seconds) to heat the board and can be used in closed loop mode (taking a temperature reading and altering the power to hit a desired thermal profile) or open loop (where the lamps simply heat the assembly without imposed power control)

For thicker boards, convection heating may be used. This technology is slower to respond than IR resulting in pre-heating steps in the range of multiple minutes compared to 1-2 minutes for IR. Convection is, however, able to evenly heat thicker PCBs and isn’t bound by the reflectivity issue of different wavelengths of IR lamps.

To achieve the optimal pre-heating for a specific product, a thermal profiler should be used to determine the maximum temperature, thermal ramp rate and pre-heating time. For some processes, the PCB is then enough that pre-heating doesn’t need to be used and the heating from the applied solder is enough. The order of fluxing and pre-heating can be changed depending on the process requirements for the board and depending upon the flux being used. As heating is applied to the board, a water-based flux will spread whereas an alcohol-based flux will begin to evaporate. Proper process engineering ensures that the order and timings of these processes are specified.

Following these steps, it’s finally time for soldering. As with all the other elements of the selective process, there are multiple parameters and options to consider during this step:

  • Inertion: To maintain good flow characteristics and reduce the amount of bridging, a low-oxygen environment is used. Nitrogen is typically used for inertion to achieve sub 10 ppm of oxygen. 50 ppm of oxygen is the maximum permissible limit, above this the solder quality is affected and dross is generated at a higher rate.
  • Positioning of the solder bath[2]: The bath positioning can be used to either apply soldering to a single joint or closely packed series of joints in a dip step or movement along the underside of a PCB. The machine can be programmed for rows of connectors as part of a draw step.
  • Contact time of solder: Greater contact time can aid wetting and pull-through of solder but increasing the time can dissolve copper from the PCB.
  • Type of solder: lead-free or leaded; inclusion of additives to alter the liquid properties or the mechanical properties of the solidified joint.
  • Use of wetting or non-wetting nozzles: non-wetting dip nozzles can be used for fast production of high-volume products, but they lose the per-joint customisation of a wetting nozzle.
  • Top-side heating during soldering: used if the assembly has a high thermal mass that required continuous heating to ensure good solder pull-through.
  • Solder temperature: The soldering temperature is chosen to balance good pull-through, flux activation loss and increased likelihood of oxidation. Generally, the temperature will be in the range of 280-320 °C.
  • Board warp correction: the application of heat to the PCB can warp it enough to affect the soldering process. The use of a laser positioning sensor can apply live offsets to the programmed height to achieve good soldering.
[2] Pillarhouse typically employs a fixed PCB during soldering with a moving soldering bath and nozzle.

Nozzle size and type can be customised for specific joints but there correct programming must still be utilised as there are so many parameters that interact to produce a well-soldered joint. With new materials engineering, the maintenance can be reduced as with the AP Master nozzles [3,4]. The increased wetting enabled by surface engineering technologies allows for faster start-up of the nozzles, easier rewetting and less dewetting during process. Cleaning is still essential to keep a nozzle running well no matter the material design[3].

[3] Nozzles are also cleaned with flux however a different chemistry is utilized to remove the oxides that form on the surface of the ferrous materials utilized as nozzles.

A unique item that poses a challenge is not, in fact, an issue of process technology but is more people-centred. No one likes doing maintenance, but it is essential to keep all machines working properly. Machine wear out is inevitable. Proactive maintenance is undoubtedly better for a full production environment but this is more time intensive and requires greater planning [5].

Sometimes nozzle sizes are chosen to fulfil the requirements of multiple products. In this case, it is often more optimal to use planned machine downtime to swap to a different nozzle size to produce better soldering quality. This takes more time and planning from maintenance staff, however. Some customers will opt to use a heated bath trolley to allow for faster changing of baths (to use different solders or a different nozzle geometry). The heating function also allows maintenance to be carried out of the baths outside of the soldering system; when the bath cools the impeller chamber is frozen, so it is inaccessible.

Finally, electronics manufacturing is becoming increasingly automated, and the soldering systems must be adapted to fully integrate with this new paradigm of manufacturing. Examples include the use of robot arms to load PCBs into the machines, re-soldering in in-line soldering machines based on optical inspection results and automated nozzle conditioning and solder top-up systems.

2.2. Board-specific challenges

Often Pillarhouse engineers will encounter PCBs where little consideration has been given to the end manufacture process. As selective soldering will be viewed as the last element of the manufacturing chain, it is the last thing a design team may think about. Furthermore, many design teams may not be experienced with optimal design elements to enable fast processing with selective soldering. Often extended nozzles need to be used to work around tall components. Additionally, customers will approach Pillarhouse with boards that were built with surface mount technology (SMT) assembly in mind necessitating the use of smaller nozzles with more precise programming.

With the rapid increase in electric vehicle systems, there has been an increase in PCBs bonded to larger cooling assemblies which pose a challenge in terms of pre-heat as well as soldering larger components such as insulated-gate bipolar transistors (IGBTs).

These board-specific challenges require careful setting of process parameters to ensure good soldering within the time requirements. This involves setting the pump speed to achieve the correct level of solder fill and ensuring the nozzle remains wetted, programming the optimal vectoring of the solder bath and pull-off characteristics to reduce bridging.

3.     The Selective Soldering Academy (SSA)

Due to the level of adoption of selective soldering technologies and their importance in the circuit board assembly process, it’s now more likely that you will find more assembly facilities with it than without[6]. To be able to maintain and run a selective soldering machine and overcome the challenges described above, training is essential.

The SSA exists to train anyone (not just those with Pillarhouse equipment) on the correct practices for running equipment, maintenance and how to approach programming new boards to enable customers to set up new processes quickly, keep them running and maximise the financial impact of the selective soldering process.

4.     The SSA Challenge Board

The main teaching element of the SSA is the Challenge board. It’s unlikely that a real-world soldering process will possess all the elements in this PCB; function is not the aim of this board, it is designed to be difficult to solder and it’s impossible to successfully solder all elements with one type of nozzle.

The board is 0.075” (1.91 mm) thick with 4.2 oz (56.7 g) copper layers. Two of the layers are ground planes while the other two have only traces. Some connections to the ground planes are heat relieved.

Silkscreen is used to partition each area of the board and each section is numbered to help identify the specific techniques to be used in each. SMT and THT are on both the board’s top and bottom sides. Figure 1 shows the bottom-side of the PCB which is the starting point for THT soldering.

Figure 1. Bottom-side view of the SSA Challenge board.

Figure 2 shows the top side of the PCB. Unlike the bottom-side, the top-side SMT and some nearby THT parts are functional and are highlighted in yellow. This is part of the surface insulation resistance (SIR) test area. There is also a simulated SIR coupon to be soldered to the board in the green highlighted area.

Figure 2. Top-side view of the SSA Challenge board.

Figure 3 shows a close-up image of one of the test areas on the bottom-side of the board. The red highlighted areas are for practising soldering using the micro-nozzle allowing you to solder near metallised areas or SMT components. The blue area is to test the effectiveness of fluxes for solder spreading; the cross pattern is used to highlight the spreading further. The yellow area is to test the wetting performance of flux on a bare metal finish. A solder draw can be programmed on this area to observe solder wetting and spreading. Finally, the green area is used to observe flux wetting on solder mask.

Figure 3. Closeup of solder and flux test areas.

5.     Conclusions and future developments

Selective soldering has now reached a stage of maturity where it can be considered its own processing technology. As a result of this, PCBs should be designed with this processing technology in mind however the innovations in selective soldering (e.g., the micro-nozzle) can mitigate against designs where this is not possible. Experienced and knowledgeable staff will be able to program process conditions to maximise the potential of selective soldering. Emerging markets such as electric vehicles have shown that selective soldering technologies continue to grow in popularity. The AP Master Nozzle technology will enable increased soldering capabilities and easier maintenance of wettable nozzles to help meet the demands of growing markets.

For more information on Pillarhouse International’s AP Master Nozzle, read here: Selective Soldering: A Need For Innovation and Development (pillarhouse.co.uk)

 

References

[1]        S.J. McMaster, A. Cobley, J.E. Graves, N. Monk, Selective Soldering: A need for Innovation and Development, J. Inst. Circuit Technol. 15 (2022). https://instct.org/news/journals/ict-journal-vol-15-no-3#paper_2 (accessed October 23, 2022).

[2]        J. Bath, Lead-free Soldering Process Development and Reliability, Wiley, 2020.

[3]        S.J. McMaster, A. Cobley, J.E. Graves, N. Monk, Selective soldering nozzles: insights into wear mechanisms and future developments, in: IPC APEX Tech. Conf. Proc., San Diego, 2023.

[4]        Selective soldering nozzles: insights into wear mechanisms and future developments, 2023. https://youtu.be/w5MaHJxQ_J0 (accessed May 22, 2023).

[5]        M.G. Deighton, Maintenance Management, in: Facil. Integr. Manag., Elsevier, 2016: pp. 87–139. https://doi.org/10.1016/B978-0-12-801764-7.00005-X.

[6]        Selective Soldering Academy, About – SSA – Selective Soldering Academy, (2023). https://solderingacademy.com/about/ (accessed May 18, 2023).

[1] Typically fluxing will be applied before pre-heating for PCB solder processing so that the temperature of the pre-heat step can activate the flux.

[2] Pillarhouse typically employs a fixed PCB during soldering with a moving soldering bath and nozzle.

[3] Nozzles are also cleaned with flux however a different chemistry is utilized to remove the oxides that form on the surface of the ferrous materials utilized as nozzles.

03 May 2023
smt connect 2023

Pillarhouse International at SMT Connect 2023

Pillarhouse International at SMT Connect 2023

Pillarhouse International will be exhibiting at SMT Connect 2023, at Stand 4-321 of the Nuremberg Exhibition Centre, Nuremberg, Germany from the 9th to the 11th of May 2023.

For over 40 years, Pillarhouse International has been designing and manufacturing specialist soldering equipment for the electronics industries, offering an extensive range of selective soldering solutions from low cost, flexible, standalone, benchtop, entry-level systems, through to advanced, high speed, integrated, in-line production cells.

At SMT Connect 2023, Pillarhouse will be exhibiting the Jade MKII – our most successful machine selling over 1,200 units globally to date. The Jade MKII is a single point selective soldering system designed to meet the needs of the small/medium batch manufacturer who requires high levels of production flexibility, offering uncompromised selective soldering quality at a very low cost.

A handload system, the Jade MKII incorporates a universally adjustable tooling carrier capable of accommodating PCBs or pallets up to  457 x 508mm in size. As part of the philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return-to-bath technology offering reduced solder balling potential.

Speaking ahead of the SMT Connect 2023 Exhibition, Pillarhouse International Sales Manager, David Johnson, said, “SMT Connect is a show we haven’t been able to attend for a few years due to COVID and other factors, so we are really looking forward to attending this year’s show as we feel it is a premium exhibition for Pillarhouse in Europe. Many of our agents and customers will be at SMT Connect, and this is another great opportunity to be visible in Germany, a key European market, as we often are.”

SMT Connect is a trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.

In line with its motto “Driving Manufacturing forward”, SMT Connect provides an ideal setting for sharing ideas within the electronic manufacturing community, developing tailored solutions for electronic assemblies and systems, laying the groundwork for business deals, and improving skills.

Pillarhouse will be at Stand 4-231 of the Nuremberg Exhibition Centre, Nuremberg, Germany from the 9th to the 11th of May 2023.

For more information about SMT Connect 2023, please visit: SMTconnect – Solutions for Electronic Assemblies and Systems (mesago.com)

To view this event in Pillarhouse International’s calendar, please visit: Events – Pillarhouse International

03 May 2023
silicon mountain

Silicon Mountain Invests In Four Pillarhouse Selective Solder Systems

Silicon Mountain Invests In Four Pillarhouse Selective Solder Systems

silicon mountain     

As first seen in: Silicon Mountain Invests in Four Pillarhouse Selective Solder Systems (eletimes.com)

Silicon Mountain, a leading electronic manufacturing company, has upgraded its selective soldering department with four new selective solder systems from Pillarhouse International. The company continues to invest to maintain the flexibility, quality, and turnaround necessary to meet each customer’s unique needs.

Silicon Mountain’s selective solder through-hole systems position its clients for success. The company reduces the risks of thermal shock and excessive flux contamination inherent to traditional systems. Silicon Mountain’s through-hole systems handle fragile displays easily. They allow components to be placed onto PCBs, panels, or other assemblies without disturbing nearby surface-mount technology (SMT) components. Silicon Mountain offers clients the speed and flexibility of its systems to help achieve repeatable success in their competitive markets.

“With this investment, we are enhancing our selective soldering capabilities and reinforcing our commitment to delivering the highest-quality electronic components to our customers,” Clint Roehr, Project Manager at Silicon Mountain. “This acquisition is a significant step forward for Silicon Mountain, and we are excited about the opportunities it will bring.”

The Pillarhouse International Orissa Synchrodex is a modular selective soldering system designed to eliminate the need for hand soldering. The first module in the line is equipped with a precision drop-jet fluxer and upper and lower pre-heat modules. The next two modules have bottom side pre-heat, a drop-jet fluxer, and solder pot/pump/nozzle setups.

The pre-heat helps with flux activation and raises the board temperature for better solder flow and reduced dwell time on the solder joints. All machines incorporate fiducial correction for increased accuracy. Having two soldering modules allows the soldering program to be split for increased flexibility and efficiency.

Silicon Mountain provides a wide range of services, whether it is prototyping for start-ups or high-volume manufacturing. Regardless of the service, the company aims for high quality and quick turnaround.

For more information about Silicon Mountain, please visit World Class Electronics Manufacturing | Silicon Mountain – SMCS (siliconmtn.net)

12 Apr 2023
AP Master Nozzle

Selective Soldering: A Need For Innovation and Development

Selective Soldering: A Need For Innovation and Development

As first seen in: The Institute of Circuit Technology – ICT Journal Vol 15 No 3 (instct.org)

Authored By: Dr. Samuel J. McMaster*1, Professor Andrew Cobley*1, Dr. John E. Graves*1, Nigel Monk*2

1 – Functional Materials and Chemistry Research Group, Research Centre for Manufacturing and Materials, Institute of Clean Growth and Future Mobility, Coventry University, Priory Street, Coventry CV1 5FB, UK

2 – Pillarhouse International Ltd., Rodney Way, Chelmsford, Essex CM1 3BY, UK

 

1. Introduction

Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.

Nozzles can vary by size (internal diameter) and shape (making them suitable for different process types). This is all dictated by board design and process requirements. Selection of the nozzle type is dependent upon the product to be soldered and the desired cycle time. Examples of different nozzle types are shown here.

Handload selective systems must be programmed with the parameters for multiple solder joints. However, many in-line systems are designed to be modular. This modularity allows for multiple solder stations with different conditions/nozzles to achieve low cycle times. Figure 1 shows the two distinct types of selective soldering systems offered by Pillarhouse International Ltd.

(a)Jade MKII( b) Synchrodex Pro

Figure 1. Examples of different Pillarhouse International selective soldering systems. (a) Jade MKII handload system. (b) Orissa Synchrodex Pro modular in-line system.

Selective soldering provides many other benefits compared to wave and hand soldering such as:

  • Minimal thermal shock.
  • Lower running costs than wave soldering.
  • Operation under an inert environment to minimise soldering defects, reduce the production of dross and improve wetting performance (more details below).
  • Applicability to low and high-volume production.
  • Repeatability in the process and solder joints.
  • Fewer operators required.

 

2. Key attributes of nozzles

To ensure that controlled application of the solder is maintained throughout the process, the solder must wet (adhere) to the nozzle. Wettability is the study of the adhesion of liquids to solids because of the interaction between the surface energy of the solid and the surface tension of the liquid [1,2]. Surface energy (known as surface tension when referring to liquids) is a result of the relative bond strength of the material and the level of unbalanced forces at the surface [1,2]. Multiple methods exist to characterise surface energy depending upon the components of the surface interaction that can be measured [3] however the most common is measuring the contact angle of a stationary (sessile) droplet.

When no other forces act upon a liquid droplet (i.e., no contact with other surfaces and no air resistance due to movement), it will form a sphere as its own surface tension pulls it into that shape as it is the minimum energy shape it can be. When in contact with a solid, the droplet will deform and spread out. The amount of spreading and the angle of the interface between the liquid and solid is a product of the relation between the surface tension of the liquid and the surface energy of the solid. Figure 2 demonstrates scenarios with various levels of wetting. When the surface energy of the solid is greater than the surface tension of the liquid, the droplet will spread out more and have a lower contact angle [1,3]. Figure 2(a) and (b) are an example of this.

Figure 2. Examples of different contact angles between a droplet (stripped red) and solid (blue): (a) Contact angle of 0° demonstrating perfect wetting. (b) Contact angle less than 90°for a wetting surface. (c) Contact angle greater than 90° hydrophobic surface. By Idris.abk – Own work, CC BY-SA 4.0, https://commons.wikimedia.org/w/index.php?curid=97191171

Typically, a static system would be preferred for wettability studies, but we are dealing with a dynamic process in the case of a nozzle. In this instance, the wetting of the solder to the tip of the nozzle maintains a stable radial wave and achieves control during the soldering process by maintaining a stable dome shape to deposit solder.

Figure 3 shows a well wetted nozzle wherein the solder is adhered to the entire outer surface of the nozzle and therefore has a stable radial wave. This allows for good control during the selective soldering process. The static wettability for this nozzle would be akin to Figure 2 (a) or (b).

Figure 3. An example of a wetted nozzle.

In the case of a material that solder does not readily wet to (non-wetting), the surface energy of the nozzle (or other material being wetted) is not enough to overcome the surface energy of the solder and therefore the solder will maintain a single stream as shown in Figure 4. The static wettability of this nozzle would produce a large contact angle such as in Figure 2 (c).

Figure 4. An example of a non-wetting nozzle.

For wetting between the liquid solder and the nozzle, there must be a clean interface with minimal surface oxides on the nozzle. The presence of oxides on the surface interferes with the wetting of the solder to the surface by acting as a barrier; additionally, the surface energy of oxides is too low for wetting to occur. Flux is used to remove oxides and generate/maintain this clean interface before and during operation. After cleaning, a chemical reaction between the solder and nozzle determines the extent of the wetting but this interaction also limits the lifetime of the nozzle. It causes wear of the nozzle and metal is leached into the solder bath. Exposure to the solder and the subsequent reaction alone does not cause significant wear. The contribution of liquid flow increases the wear in a synergistic effect which suggests that the underlying mechanism is complex corrosion-erosion.

Therefore, a good nozzle must have good wettability to solder ensuring that control can be maintained during the selective soldering process in addition to a balance between the corrosion and wetting. The composition must be chosen carefully in materials to achieve this. For example, extremely wettable materials such as copper have a high dissolution rate and will therefore be completely leached into the bath within hours demonstrating the link between the wear process and wetting.

 

3. The need for development

Currently, the selective soldering industry sees innovation with the production of new machines, pump types and nozzle cleaning however, there has been only minor development in the study of materials for nozzles. A new nozzle material will reduce operation and maintenance costs for manufacturers by reducing the number of nozzles required overall and reducing downtime caused by nozzle failure. Improving the wettability of nozzles will allow for more challenging joints to be tackled using the selective method. The current nozzles have a lifetime of approximately 200 hours (smaller nozzles wear faster however as they are smaller). This project has been undertaken due to customer requests to increase nozzle lifetime and reduce the maintenance required.

Other players in the selective soldering industry have developed new nozzles with similar structures based on commonly applied electroless nickel-immersion gold coatings but this approach has utilised materials that are already known to work in the industry. It is well known that the electronics industry is conservative in many regards and rightly so; “why fix what isn’t broken” especially when reliability is paramount. There has been a distinct lack of research in nozzle development. Each selective soldering manufacturer is highly secretive surrounding the materials used for their nozzles but there has been some noted development in nitriding as a surface engineering technique to extend the lifespan of wave soldering apparatus [4]. Morris and O’Keefe [5,6] also produced studies on methods to extend the lifespan of soldering components, some examples being using titanium or grey cast iron as a solder resistant material, nitriding, or the application of ceramic coating (titanium nitride).

This ground-breaking research project, part funded by Innovate UK and Pillarhouse International Ltd. is partnered with Coventry University through a knowledge transfer partnership scheme. The aim is to develop a new, longer-lasting nozzle with excellent wetting properties. By applying the studies of tribology and materials science, fundamental work looking at different materials and surface engineering techniques has selected a number of potential candidates that show improved performance.

Prototype testing has been used to confirm compatibility with existing solders and fluxes. The new AP Master Nozzle will be available in June of 2023.

 

4. References

[1]      E. Spooner, A Guide to Surface Energy, Ossila.Com. (2021) 10. https://www.ossila.com/pages/a-guide-to-surface-energy.

[2]      Biolin Scientific, Surface free energy – theory and calculations, 2013. https://cdn2.hubspot.net/hubfs/516902/Pdf/Attension/Tech%20Notes/AT-TN-04-Surface-free-energy-theory.pdf (accessed August 22, 2022).

[3]      M. Żenkiewicz, Methods for the calculation of surface free energy of solids, Journal of Achievements in Materials and Manufacturing Engineering. 24 (2007) 137–145.

[4]      Z. Sályi, Z. Veres, P. Baumli, M. Benke, Development of Nitrided Selective Wave Soldering Tool with Enhanced Lifetime for the Automotive Industry, in: Lecture Notes in Mechanical Engineering, 2017: pp. 187–195. https://doi.org/10.1007/978-3-319-51189-4_18.

[5]      J. Morris, M.J. O’Keefe, Equipment Impacts of Lead-Free Wave Soldering, Appliance. 61 (2004) 26–30.

[6]      J. Morris, M.J. O’Keefe, M. Perez, Liquid tin corrosion and lead free wave soldering, IPC – IPC Printed Circuits Expo, APEX and the Designers Summit 2007. 3 (2007) 1603–1611.